Thermal Conductive Epoxy Die Attach Adhesive
| Product name | Thermal Conductive Epoxy Die Attach Adhesive |
|---|---|
| Product number | OET-899M1 |
| Appreance | White Beige Paste |
| Curing condition | Heat Curing |
| Main Application | Epoxy Die Attach Adhesive for Bonding Semiconductor Chip and Thermal Management |
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If you would like to know the detailed information of our products. Please fill out this form with correct information, we will contact you as soon as possible.
Your personal information will be kept strictly confidential and will not be sold, reused, rented, loaned or otherwise disclosed.