I am looking for Moisture cure hot melt specialize in wooden flat lamination, used for WPC floor.
2020/02/26
Please kindly refer to Nanpao PUR-178 for WPC floor.
- Excellent Initial and final bonding strength.
- Good on heat- resistance and hydrolysis - resistance.
- Not beading when bonding cured.
- Low operation temperature 120~130°C.